Thermal Characterization of Buried Interfaces in Multilayer Heterostructures via TDTR with Periodic Waveform Analysis
This paper introduces a frequency-tunable periodic waveform analysis TDTR technique to non-destructively characterize buried thermal interfaces in multilayer WBG/UWBG semiconductor heterostructures, revealing distinct phonon transport mechanisms and identifying specific thermal bottlenecks in Ga2O3/SiC, GaN/Si, and GaN/diamond systems.