Bridging the Thermal Gap: Ag-MWCNT Reinforced Silver Paste as an Interfacial Interconnect for High-Power Electronic Packaging
This study demonstrates that incorporating silver nanoparticle-decorated multi-walled carbon nanotubes (Ag-MWCNTs) into a nano-silver paste significantly enhances thermal conductivity and minimizes interfacial thermal resistance, offering an effective solution for managing heat in high-power electronic packaging involving graphene films.