Sub-kelvin thermal conductivity of substrates and on-chip routing in quantum integrated systems
This study experimentally characterizes the sub-kelvin thermal conductivity of various substrate materials and on-chip routing, revealing that high-resistivity silicon offers superior thermal performance and that while routing lines enhance in-plane conductance, the substrate remains the dominant heat path, thereby emphasizing the critical importance of material selection and 3D integration for effective thermal management in large-scale quantum systems.