Wafer-to-Wafer Bonding: Part: I -- The Coupled Physics Problem and the 2D Finite Element Implementation
This paper presents a mathematically consistent reduced-order model coupling Kirchhoff-Love plate bending with Reynolds lubrication theory, implemented via a monolithic interior-penalty finite element scheme in FEniCSx, to simulate and analyze the nonlinear fluid-structure interaction dynamics of wafer-to-wafer bonding.