Synergistic effects of In nanoparticle doping and ultrasonic assistance on the interfacial microstructure and reliability of Sn58Bi/Ni solder joints
This study demonstrates that synergistically combining 0.1 wt% In nanoparticle doping with ultrasonic-assisted soldering optimizes the wettability, microstructure, and mechanical reliability of Sn58Bi/Ni joints by refining grains, forming a compact Ni₃(Sn,In)₄ interfacial layer, and achieving peak shear strength of 33.61 MPa, while excessive In content degrades these properties.