Effects of Open-Time and Jetting Pressure towards the Dispensed Adhesive Weight for Advanced Semiconductor Packaging
This study demonstrates that open-time and jetting pressure significantly influence the weight and consistency of dispensed adhesive in semiconductor packaging, identifying 1.6 ms and 0.13 MPa as optimal parameters to achieve strong bonding with minimal overflow.
Original paper licensed under CC BY 4.0 (https://creativecommons.org/licenses/by/4.0/). This is an AI-generated explanation of the paper below. It is not written or endorsed by the authors. For technical accuracy, refer to the original paper. Read full disclaimer
Imagine you are trying to paint tiny, perfect dots of glue on a microscopic circuit board to hold a computer chip together. If you use too much glue, it spills over and ruins the delicate connections. If you use too little, the chip might fall off. This is the challenge of advanced semiconductor packaging.
This research paper is like a recipe book for finding the "Goldilocks" zone of glue application. The authors, Aiman Syukri Shamsuddin and Mohd Nazri Abd Rahman, wanted to figure out exactly how two specific "knobs" on their glue machine affect the weight and quality of the glue dots they produce.
Here is a simple breakdown of their study:
The Two "Knobs" They Turned
The researchers focused on two main settings on their non-contact glue jetting machine (a machine that shoots glue without touching the surface):
- Open-Time (The "Door Open" Duration): Imagine the glue nozzle is a door. "Open-time" is how long that door stays open before slamming shut.
- Short time: The door opens and closes quickly, letting only a tiny drop out.
- Long time: The door stays open longer, letting a bigger stream of glue flow out.
- Jetting Pressure (The "Squeeze" Strength): This is how hard the machine pushes the glue out.
- Low pressure: A gentle push.
- High pressure: A hard squeeze that forces more glue out faster.
What They Discovered
The team ran a series of tests (like a scientific game of "what happens if...") to see how these two knobs changed the weight of the glue dots.
- Both Knobs Matter: Turning up either the "Open-Time" or the "Pressure" made the glue dots heavier. It's like opening a garden hose wider or turning up the water pressure; you get more water.
- The "Door" is the Boss: They found that how long the door stays open (Open-Time) had a much bigger effect on the weight than how hard they squeezed (Pressure). It's the most important dial to turn if you want to change the size of the dot.
- They Don't Fight Each Other: Interestingly, these two knobs work independently. Changing the pressure doesn't change how the "door time" works, and vice versa. This makes it easy for engineers to tune the machine without worrying that adjusting one setting will mess up the other.
Checking the Quality
Just having the right weight isn't enough; the glue dot needs to be smooth and strong.
- The "Roughness" Test: They used a super-microscope (called AFM) to look at the surface of the glue dots. They found that as the dots got heavier (due to longer open times or higher pressure), the surface got slightly rougher. Think of it like pouring honey: a small drop sits neatly, but a large, fast-poured drop might splash a bit, creating tiny bumps.
- The "Strength" Test: They performed a "Dot Shear Test," which is basically pushing the glue dot sideways to see how hard it is to break.
- Result: Heavier dots held together better. The strongest bond was found with the heaviest dots tested.
- The Catch: While heavy dots are strong, they are risky because they might spill over (overflow) and ruin the tiny electronic parts.
The "Sweet Spot" (The Solution)
The researchers needed a balance: a dot that is strong enough to hold the chip but light enough to avoid spilling.
- The Target: They decided on 11 micrograms (a tiny fraction of a gram) as the perfect weight.
- The Recipe: To get this perfect 11-microgram dot, they found the ideal settings were:
- Open-Time: 1.6 milliseconds (a tiny fraction of a second).
- Pressure: 0.13 MPa (a moderate squeeze).
- The Result: At these settings, the glue dots were uniform, repeatable, and strong, with a "desirability score" of 1.0 (meaning it was a perfect match for their goals).
The Bottom Line
This paper proves that by carefully controlling how long the glue nozzle stays open and how hard it pushes, manufacturers can create perfect, consistent glue dots for computer chips. They found that time is more important than force when controlling the amount of glue, and that a specific "middle ground" setting gives the best balance between a strong bond and a clean, spill-free application.
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